DocumentCode :
1175487
Title :
Enhancing yield at the end of the technology roadmap
Author :
Sirisantana, Naran ; Paul, Bipul C. ; Roy, Kaushik
Volume :
21
Issue :
6
fYear :
2004
Firstpage :
563
Lastpage :
571
Abstract :
Scaled manufacturing technologies require advanced techniques for improving device reliability and production yield. We present a transistor-level redundancy technique for manufacturing devices with low vulnerability and improving yield in future circuits The technique relies on appropriate design style selection and controlled redundancy to achieve area and power trade-offs.
Keywords :
CMOS integrated circuits; integrated circuit manufacture; integrated circuit reliability; logic circuits; logic design; logic testing; redundancy; manufacturing devices; roadmap technology; scaled manufacturing technology; transistor-level redundancy technique; Circuit faults; Circuit noise; Circuit testing; Design methodology; Fault tolerance; Manufacturing industries; Power amplifiers; Production; Redundancy; Semiconductor device measurement;
fLanguage :
English
Journal_Title :
Design & Test of Computers, IEEE
Publisher :
ieee
ISSN :
0740-7475
Type :
jour
DOI :
10.1109/MDT.2004.86
Filename :
1363711
Link To Document :
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