Hybrid ring coupler for W-band MMIC applications using MEMS technology

Author

Kim, Sung-Chan ; Ko, Baek-Seok ; Baek, Tae-Jong ; Lim, Byeong-Ok ; An, Dan ; Shin, Dong-Hoon ; Rhee, Jin-Koo

Author_Institution

Millimeter-wave INnovation Technol. Res. Center, Dongguk Univ., Seoul, South Korea

Volume

15

Issue

10

fYear

2005

Firstpage

652

Lastpage

654

Abstract

The hybrid ring coupler was designed and fabricated on a GaAs substrate using surface micromachining techniques, which adopted dielectric-supported air-gapped microstrip line (DAML) structure. The fabrication process of DAML is compatible with the standard monolithic microwave integrated circuit (MMIC) techniques, and the hybrid ring coupler can be simply integrated into a plane-structural MMIC. The fabricated hybrid ring coupler shows wideband characteristics of the coupling loss of 3.57 ± 0.22dB and the transmission loss of 3.80 ± 0.08dB across the measured frequency range of 85 to 105GHz. The isolation characteristics and output phase differences are -34dB and 180±1°, at 94GHz, respectively.

Keywords

III-V semiconductors; MMIC; gallium arsenide; micromachining; micromechanical devices; microstrip lines; millimetre wave couplers; 85 to 105 GHz; DAML structure; MEMS technology; W-band MMIC applications; dielectric-supported air-gapped microstrip line structure; hybrid ring coupler; monolithic microwave integrated circuits; plane-structural MMIC; surface micromachining; Coupling circuits; Dielectric substrates; Fabrication; Gallium arsenide; Integrated circuit technology; MMICs; Micromachining; Micromechanical devices; Microstrip; Propagation losses; Dielectric-supported air-gapped line (DAML); hybrid ring coupler; microelectromechanical systems (MEMS); monolithic microwave integrated circuit (MMIC);

fLanguage

English

Journal_Title

Microwave and Wireless Components Letters, IEEE

Publisher

ieee

ISSN

1531-1309

Type

jour

DOI

10.1109/LMWC.2005.856684

Filename

1512211