DocumentCode :
1176146
Title :
Wire bonded interdigital capacitor
Author :
Casares-Miranda, Francisco P. ; Otero, Pablo ; Márquez-Segura, E. ; Camacho-Peñalosa, C.
Author_Institution :
Dipt. Ingenieria de Comunicaciones, Univ. de Malaga, Spain
Volume :
15
Issue :
10
fYear :
2005
Firstpage :
700
Lastpage :
702
Abstract :
Interdigital capacitors (IDCs) are convenient capacitance devices in microstrip circuits, even if only low capacitance values can be achieved. Nevertheless, undesired resonances degrade their performance when frequency increases. Short circuits across the end of alternate fingers of the IDC improve its high frequency response by eliminating that drawback. Simulated and measured results are presented.
Keywords :
capacitors; interconnections; microstrip components; capacitance device; microstrip circuits; microwave passive circuits; short circuits; wire bonded interdigital capacitor; Bonding; Capacitance; Capacitors; Circuits; Degradation; Fingers; Frequency; Microstrip; Resonance; Wire; Interdigital capacitor (IDC); microwave passive circuits; wire bonded interdigital capacitor (WBIDC); wire bonding;
fLanguage :
English
Journal_Title :
Microwave and Wireless Components Letters, IEEE
Publisher :
ieee
ISSN :
1531-1309
Type :
jour
DOI :
10.1109/LMWC.2005.856835
Filename :
1512227
Link To Document :
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