DocumentCode :
1176300
Title :
Implantable multichannel electrode array based on SOI technology
Author :
Cheung, Karen C. ; Djupsund, Kaj ; Dan, Yang ; Lee, Luke P.
Author_Institution :
Dept. of Bioeng., Univ. of California, Berkeley, CA, USA
Volume :
12
Issue :
2
fYear :
2003
fDate :
4/1/2003 12:00:00 AM
Firstpage :
179
Lastpage :
184
Abstract :
This work presents a new method of fabricating implantable multielectrode arrays on lightly doped single-crystal silicon. Such arrays are essential tools for electrical stimulation and recording of nerve signals. Our new microfabrication process, based on silicon-on-insulator (SOI) technology, inherently has excellent control over the final probe thickness without wet etching. The needle shanks are 6 mm long and 80 μm wide. Here the thickness of the probe, 25 μm, is defined by the device layer thickness on the SOI wafer. Our new sprinkler fluidic channel, which has holes spaced 50 μm apart along its 6 mm length, permits the perfusion of a large area of tissue with any desired neurotransmitter or other drug. The probes fabricated here are tested in the cat primary visual cortex; data recorded from adjacent neurons was used to characterize their orientation tuning. The sprinkler channel was characterized, and flowrate through the channel is a linear function of the applied pressure.
Keywords :
arrays; biomedical electrodes; drug delivery systems; microelectrodes; microfluidics; neurophysiology; probes; silicon-on-insulator; 25 micron; 6 mm; 80 micron; SOI technology; Si; drug delivery; electrical recording; electrical stimulation; implantable multielectrode arrays; integrated fluidic channels; lightly doped single-crystal Si; microfabrication process; multichannel electrode array; needle shanks; nerve signals; neurotransmitter delivery; probe thickness; sprinkler fluidic channel; Drugs; Electrical stimulation; Electrodes; Needles; Neurotransmitters; Optical arrays; Probes; Silicon on insulator technology; Thickness control; Wet etching;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2003.809962
Filename :
1192712
Link To Document :
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