Title :
A servo-controlled capacitive pressure sensor using a capped-cylinder structure microfabricated by a three-mask process
Author :
Park, Jae-Sung ; Gianchandani, Yogesh B.
Author_Institution :
Dept. of Mech. Eng., Wisconsin Univ., Madison, WI, USA
fDate :
4/1/2003 12:00:00 AM
Abstract :
A silicon-micromachined servo-controlled capacitive pressure sensor is described. The use of a capped-cylinder shape with pick-off electrodes external to a sealed cavity permits this device to be fabricated in only three masking steps. Device behavior is evaluated experimentally and by finite element analysis. A fabricated device with 2 mm diameter, 9.7 μm structural thickness and 10 μm cavity height provides a measured sensitivity of 0.516 V/kPa over a dynamic range of 20-100 kPa gauge pressure, with a nonlinearity of <3.22% of full scale. The open-loop sensitivity of this device averaged over a dynamic range of 0-250 kPa is -408 ppm/kPa. A voltage bias applied to the servo-electrode can be used to tune both the open-loop and servo-controlled sensitivity by more than 30%. An alternative design in which the Si electrode is segmented to relieve residual stress provides 10-20% more open-loop sensitivity with similar structural dimensions. Fabricated devices are sealed within a metal package filled with an inert dielectric liquid. This enhanced open-loop sensitivity by a factor of about 1.7, and in servo-controlled operation, reduced restoring voltage by a similar factor. Measurements and analysis of temperature responses of these devices are presented.
Keywords :
capacitive sensors; encapsulation; internal stresses; microelectrodes; micromachining; microsensors; packaging; pressure sensors; sensitivity; servomechanisms; silicon; 0 to 250 kPa; 1 mm; 10 micron; 9.7 micron; Si; Si electrode segmentation; Si micromachined capacitive pressure sensor; capped-cylinder shape; dissolved wafer process; finite element analysis; inert dielectric liquid; liquid encapsulation; metal package; microfabrication; open-loop sensitivity; pick-off electrodes; residual stress relief; sealed cavity; servo-controlled capacitive pressure sensor; servo-controlled sensitivity; servo-electrode; three-mask process; voltage bias; Capacitive sensors; Dynamic range; Dynamic voltage scaling; Electrodes; Finite element methods; Pressure measurement; Residual stresses; Sensor phenomena and characterization; Shape; Thickness measurement;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2003.809953