Title :
Measurements of vacuum field emission from bio-molecular and semiconductor-metal eutectic composite microstructures
Author :
Kirkpatrick, Douglas A. ; Schoen, Paul E. ; Stockton, W.B. ; Price, R. ; Baral, S. ; Kahn, Brian E. ; Schnur, JOEL M. ; Levinson, Mark ; Ditchek, Brian M.
Author_Institution :
Sci. Applications Int. Corp., McLean, VA, USA
fDate :
10/1/1991 12:00:00 AM
Abstract :
Designs, calculations, and initial data are presented from a program investigating the use of biomolecular and eutectic composite microstructures as vacuum field-emission cathodes. Calculations, supported by the initial data, indicate that these electron sources should be capable of macroscopic beam current densities, J⩾100 A/cm2, without the formation of a surface plasma. The absence of a plasma allows these cathodes to operate as a long-pulse to DC electron sources. The designs avoid the formation of surface plasma by forcing the current emitted from the tips to transit a thin layer of silicon. The natural high-field current-limiting nature of the silicon serves to prevent the ablation of tip structures and the subsequent formation of cathode plasma. Initial data obtained with these microstructures has demonstrated Fowler-Nordheim characteristic emission. Coated bio-molecular composite cathodes have demonstrated stable DC current densities of ~100 mA/cm2, and the eutectic composite cathodes have demonstrated similarly stable DC current densities of ~1 A/cm2
Keywords :
biomolecular electronics; composite materials; electron field emission; eutectic structure; semiconductors; vacuum microelectronics; DC current; DC electron sources; Fowler-Nordheim characteristic emission; Si; ablation; coated biomolecular composite cathodes; electron sources; field-emission cathodes; high-field current-limiting nature; macroscopic beam current densities; semiconductor-metal eutectic composite microstructures; tip structures; vacuum field emission; Cathodes; Current density; Electron sources; Microstructure; Particle beams; Plasma density; Plasma properties; Plasma sources; Plasma stability; Silicon;
Journal_Title :
Plasma Science, IEEE Transactions on