Signal Integrity and EMC/EMI Measurement Analysis of RF MEMS Devices via a Combined FETD/Higher Order FVTD Technique

The accurate modeling of modern radio-frequency microelectromechanical systems, tailored for broadband applications, is developed in this paper through a new 3-D domain decomposition technique. The proposed scheme blends a modified finite-element time domain and an enhanced finite-volume time-domain algorithm in general curvilinear coordinates to separate the total problem into smaller flexible regions and provide rapid signal-integrity estimations. Among its key features is the introduction of dual vector operators, both in space and time, which diminish the impact of inherent mesh errors and soothe intermodulation distortions. Adjacent subdomains are successfully treated by an equivalent surface current approach, without the need for simplified conventions. Numerical results, addressing comparisons of various structures with reference/measurement data, certify our method and reveal its applicability.