DocumentCode
1177072
Title
Development of novel fabrication techniques for a silicon micro-vertex detector unit using the Flip-Chip bonding method
Author
Saitoh, Y. ; Takeuchi, H. ; Mandai, M. ; Koseki, O. ; Yoshino, T. ; Kanazawa, H. ; Yamanaka, J. ; Miyahara, S. ; Kamiya, M. ; Fujita, Y. ; Higashi, Y. ; Ikeda, H. ; Ikeda, M. ; Koike, S. ; Matsuda, T. ; Ozaki, H. ; Tanaka, M. ; Tsuboyama, T. ; Avrillon, S
Author_Institution
Seiko Instrum. Inc., Chiba, Japan
Volume
41
Issue
4
fYear
1994
fDate
8/1/1994 12:00:00 AM
Firstpage
1192
Lastpage
1196
Abstract
Full-size models of a detector unit for a silicon micro-vertex detector were built for the KEK B factory. The Flip-Chip Bonding (FCB) method using a new type anisotropic conductive film (ACF) was examined. The structure using the new type ACF and improved fabrication process provide a sufficient electrical connection and good reliability for the detector unit
Keywords
circuit reliability; semiconductor counters; thin film circuits; wafer bonding; Flip-Chip bonding method; KEK B factory; Si; anisotropic conductive film; electrical connection; novel fabrication techniques; reliability; semiconductor; silicon micro-vertex detector unit; Anisotropic conductive films; Bonding; Bridges; Decision support systems; Detectors; Fabrication; Physics; Silicon; Steel; Very large scale integration;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/23.322882
Filename
322882
Link To Document