DocumentCode
1179531
Title
Modelling of thermal failure of metallic interconnects under electrostatic discharge transients
Author
Amin, K.M. ; Fikry, W. ; Sabry, M.N. ; Ragai, H.F.
Author_Institution
Egypt Air, Maintenance & Eng. Co., Cairo, Egypt
Volume
41
Issue
19
fYear
2005
fDate
9/15/2005 12:00:00 AM
Firstpage
1056
Lastpage
1057
Abstract
Temperature dependence of metal electrical resistivity is taken into account in modelling of thermal failure of metallic interconnects under electrostatic discharge (ESD) events. SPICE-based electro-thermal modelling is used to calculate the maximum temperature rise in the interconnect during stress. New ESD design guidelines for interconnects, based on the threshold temperature of latent failure, are proposed to optimise the interconnect width.
Keywords
electrical resistivity; electrostatic discharge; heat transfer; integrated circuit interconnections; integrated circuit reliability; optimisation; thermal analysis; transients; ESD design guidelines; electrostatic discharge transients; electrothermal modelling; heat transfer; integrated circuit interconnections; integrated circuit reliability; interconnect width optimisation; metal electrical resistivity; metallic interconnects; temperature dependence; thermal analysis; thermal failure modelling;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20052032
Filename
1512753
Link To Document