DocumentCode
1180093
Title
Temperature Variation Characterization and Thermal Management of Multicore Architectures
Author
Kursun, Eren ; Cher, Chen-Yong
Volume
29
Issue
1
fYear
2009
Firstpage
116
Lastpage
126
Abstract
Increased variability affects the efficiency of dynamic power and thermal management. Existing on-chip sensor infrastructure can be used to improve the inherent thermal imbalances among cores in a multicore architecture. Experimental analysis based on live measurements on a special test chip shows reduced on-chip heating with no performance loss.
Keywords
logic design; multiprocessing systems; system-on-chip; thermal management (packaging); dynamic power management; multicore architecture; on-chip sensor infrastructure; temperature variation characterization; thermal management; Energy management; Loss measurement; Multicore processing; Performance analysis; Semiconductor device measurement; Sensor phenomena and characterization; Temperature sensors; Testing; Thermal management; Thermal sensors; activity migration; dynamic temperature management; multicore architectures; temperature-aware scheduling; thermal imaging; thermal variation;
fLanguage
English
Journal_Title
Micro, IEEE
Publisher
ieee
ISSN
0272-1732
Type
jour
DOI
10.1109/MM.2009.18
Filename
4796175
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