Title :
Flip Chip Assembly - A New Thin Film Approach to Single-Crystal Logic Operators
Author_Institution :
Light Military Electronics Department General Electric Company Utica, New York
Keywords :
Aluminum; Assembly; Degradation; Flip chip; Integrated circuit interconnections; Logic; Microelectronics; Packaging; Substrates; Transistors;
Journal_Title :
Aerospace and Navigational Electronics, IEEE Transactions on
DOI :
10.1109/TANE.1963.4502276
