Title :
Signal Integrity Flow for System-in-Package and Package-on-Package Devices
Author :
Pulici, Paolo ; Vanalli, Gian Pietro ; Dellutri, Michele A. ; Guarnaccia, Domenico ; Iacono, Filippo Lo ; Campardo, Giovanni ; Ripamonti, Giancarlo
Author_Institution :
Comput. Peripherals Group, STMicroelectronics, Cornaredo
Abstract :
As data rates required for systems in package (SiPs) increase and their complexity increases, signal integrity issues become increasingly difficult to address. The design flow of the SiP should therefore take into account these issues from the beginning. A design flow aimed at designing the SiP tracks is presented; its suitability for the design of packages comprising multiple stacked memories is verified through a design example. The proposed flow for signal integrity can be integrated easily within the complete design of the SiP.
Keywords :
signal processing; system-in-package; crosstalk; package-on-package devices; signal integrity flow; system-in-package; Analytical models; Costs; Degradation; Integrated circuit modeling; Integrated circuit packaging; Process design; Signal analysis; Signal design; Signal generators; Signal processing; Crosstalk; ground bounce; package on package (PoP); parasitics; system in package (SiP);
Journal_Title :
Proceedings of the IEEE
DOI :
10.1109/JPROC.2008.2007469
