• DocumentCode
    1181260
  • Title

    3-D Integration Technologies [Scanning the Issue]

  • Author

    Campardo, Giovanni ; Ripamonti, G. ; Micheloni, Rino

  • Volume
    97
  • Issue
    1
  • fYear
    2009
  • Firstpage
    5
  • Lastpage
    8
  • Abstract
    This issue responds to the observation that only the surface of an integrated circuit is electrically active; it explores three-dimensional techniques to extend Moore´s Law by a variety of approaches including the thinning and stacking of chips.
  • Keywords
    Integrated circuit technology; Power system reliability; Special issues and sections; Thermal management; Three dimensional displays;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/JPROC.2008.2007450
  • Filename
    4796283
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1181260