• DocumentCode
    118200
  • Title

    Impact of the packaging structural geometry on the conformal coating LED performance by optical simulation

  • Author

    Gong Yu-bing ; Liao Zhi-ping

  • Author_Institution
    Sch. of Mech. & Electr. Eng., Guilin Univ. of Electron. Technol., Guilin, China
  • fYear
    2014
  • fDate
    12-15 Aug. 2014
  • Firstpage
    24
  • Lastpage
    27
  • Abstract
    The conformal coating phosphor converted white light emitting diodes (pc-WLED) is one of the important high power white LED. The LED packaging structure is critical for the pc-WLED optical performance. In this paper, the impact of the five conformal coating pc-WLED packaging structure and its corresponding process design parameters on the LED optical performance was studied comprehensively. Firstly, the five optical models of the conformal coating pc-LED were built. The impact of the position deviation of the LED chip on the LED optical performance was investigated, respectively. The results show for the model III, model IV and model V the position deviation of the chip has less influence on the LED performance. Secondly, the influence of the phosphor extinction coefficient and quantum conversion efficiency on the LED optical performance has also been simulated for mode II and mode III. It is shown that the phosphor optical coefficient has great influence on the LED optical performance. The conclusion is helpful for the pc-WLED packaging structure design and process design.
  • Keywords
    conformal coatings; electronics packaging; light emitting diodes; phosphors; conformal coating LED performance; conformal coating pc-WLED packaging structure; conformal coating phosphor converted white light emitting diodes; high power white LED; model III; model IV; model V; optical simulation; packaging structural geometry; phosphor extinction coefficient; position deviation; process design; process design parameters; quantum conversion efficiency; Coatings; Extinction coefficients; Light emitting diodes; Optical reflection; Packaging; Phosphors; Stimulated emission; CCT; LED; phosphor; position deviation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
  • Conference_Location
    Chengdu
  • Type

    conf

  • DOI
    10.1109/ICEPT.2014.6922566
  • Filename
    6922566