Title :
Study on the POP ceramic package multilayer board design
Author :
Zhang Jie ; Wang Ke
Author_Institution :
13th Res. Inst., CETC, Shijiazhuang, China
Abstract :
In this paper, multilayer ceramic board design about the POP ceramic package is studied Stripline design such as signalline, electrical wire, offset is optimized with software such as Cadence and HFSS. Signalline transfers loss is obtained as 0.35dB/2GHz (25mm), electromagnetism isolation larger than 70dB. The complexity circuitry design for transfers loss signal delay electromagnetism isolation is satisfied The result has significance affect on multilayer board design of POP ceramic package.
Keywords :
ceramic packaging; Cadence; HFSS; POP ceramic package multilayer board design; complexity circuitry design; electrical wire; frequency 2 GHz; loss 0.35 dB; package-on-package; signalline transfers loss; size 25 mm; stripline design; transfers loss signal delay electromagnetism isolation; Ceramics; Microstrip; Nonhomogeneous media; Power transmission lines; Propagation losses; Timing; Wires; POP ceramic package; electromagnetism isolation; multilayer ceramic board; transfers loss;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922589
