Title :
Board-Level ESD of Driver ICs on LCD Panel
Author :
Tseng, Jen-Chou ; Hsu, Chung-Ti ; Tsai, Chia-Ku ; Chen, Shu-Chuan ; Ker, Ming-Dou
Author_Institution :
Taiwan Semicond. Manuf. Co., Hsinchu
fDate :
3/1/2009 12:00:00 AM
Abstract :
In this paper, a method utilizing a charged-device model (CDM) test by the tape carrier package or chip-on-film (COF) samples to emulate the real-world board-level CDM or charged-board model (CBM) electrostatic discharge is proposed for large-sized chips such as liquid-crystal display (LCD) driver ICs, which successfully duplicated the same failure by CBM discharging. For small-sized chips, the evaluation board (or printed circuit board) emulation should minimize the parasitic RLC loading of the interconnection on the board to achieve a more accurate CBM discharging. In addition, guidelines regarding chip-level design and layout optimization are proposed and have been successfully implemented to improve the immunity.
Keywords :
RLC circuits; driver circuits; electrostatic discharge; integrated circuit interconnections; integrated circuit layout; liquid crystal displays; LCD panel; charged-board model electrostatic discharge; charged-device model; chip-level design; chip-on-fllm; interconnection; layout optimization; liquid-crystal display driver; liquid-crystal display driver ICs; parasitic RLC loading; tape carrier package; Design optimization; Driver circuits; Electrostatic discharge; Emulation; Guidelines; Integrated circuit interconnections; Liquid crystal displays; Packaging; Printed circuits; Testing; Charged-board model (CBM); electrostatic discharge (ESD);
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2008.2009931
