مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

1182334

Title :

Call for Papers SISC

Volume :

Issue :

fYear :

2009

fDate :

3/1/2009 12:00:00 AM

Firstpage :

Lastpage :

Abstract :

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers.

fLanguage :

English

Journal_Title :

Device and Materials Reliability, IEEE Transactions on

Publisher :

ieee

ISSN :

1530-4388

Type :

jour

DOI :

10.1109/TDMR.2009.2015640

Filename :

4796382

Link To Document :