DocumentCode
1182489
Title
Standards for Tin Whisker Test Methods on Lead-Free Components
Author
Shibutani, Tadahiro ; Osterman, Michael ; Pecht, Michael
Author_Institution
Yokohama Nat. Univ., Yokohama
Volume
32
Issue
1
fYear
2009
fDate
3/1/2009 12:00:00 AM
Firstpage
216
Lastpage
219
Abstract
Tin whiskers are widely recognized as being a reliability threat to lead-free electronic components. The current standards to assess the tin whisker susceptibility of lead-free finishes in electronic components are problematic. Key problems include lack of data collection, lack of agreement on proper techniques for measuring whisker length, lack of established acceleration transforms for prescribed tests, and disagreement over acceptance criteria. This paper overviews the tin whisker standards and then describes the problems listed above. Recommendations for improvements are then presented and discussed.
Keywords
electronic equipment testing; electronics packaging; lead; reliability; standards; tin alloys; acceleration transforms; acceptance criteria; data collection; lead-free electronic components; reliability threat; tin whisker test methods; Bridge circuits; Electronic components; Electronic equipment testing; Electronics industry; Environmentally friendly manufacturing techniques; IEC standards; Information technology; Inspection; Surface finishing; Tin; Environmental test; lead-free electronics; standard; tin whisker;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2009.2013311
Filename
4796402
Link To Document