• DocumentCode
    1182489
  • Title

    Standards for Tin Whisker Test Methods on Lead-Free Components

  • Author

    Shibutani, Tadahiro ; Osterman, Michael ; Pecht, Michael

  • Author_Institution
    Yokohama Nat. Univ., Yokohama
  • Volume
    32
  • Issue
    1
  • fYear
    2009
  • fDate
    3/1/2009 12:00:00 AM
  • Firstpage
    216
  • Lastpage
    219
  • Abstract
    Tin whiskers are widely recognized as being a reliability threat to lead-free electronic components. The current standards to assess the tin whisker susceptibility of lead-free finishes in electronic components are problematic. Key problems include lack of data collection, lack of agreement on proper techniques for measuring whisker length, lack of established acceleration transforms for prescribed tests, and disagreement over acceptance criteria. This paper overviews the tin whisker standards and then describes the problems listed above. Recommendations for improvements are then presented and discussed.
  • Keywords
    electronic equipment testing; electronics packaging; lead; reliability; standards; tin alloys; acceleration transforms; acceptance criteria; data collection; lead-free electronic components; reliability threat; tin whisker test methods; Bridge circuits; Electronic components; Electronic equipment testing; Electronics industry; Environmentally friendly manufacturing techniques; IEC standards; Information technology; Inspection; Surface finishing; Tin; Environmental test; lead-free electronics; standard; tin whisker;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2009.2013311
  • Filename
    4796402