Title :
The coupling effect of size effect and Krikendall voids on the fracture features of Ni/Sn3.0Ag0.5Cu/Cu joint
Author :
Li Xunping ; Zhou Bin ; Yang Shaohua ; En YunFei
Author_Institution :
5th Electron. Res. Inst., Sci. & Technol. of Reliability Phys. & Applic. of Electron. Component Lab., Minist. of Inf. Ind., Guangzhou, China
Abstract :
In this study, the formation mechanisms of Kirkendall voids in Sn3Ag0.5Cu/Cu and Ni/Sn3Ag0.5Cu/Cu joints were investigation, and the coupling effect of joint size and Kirkendall voids on the fracture features of Ni/SnAgCu/Cu joints were also studied. It was found that the size effect had a significant influence on the formation of Kirkendall voids at Cu side in Sn3Ag0.5Cu/Cu and Ni/Sn3Ag0.5Cu/Cu joint, the ratio of Kirkendall voids to the total area of Cu3Sn layer increased with solder volume irrespective of the structure of joint. The coupling effect of Ni and Cu inhibited the growth of Cu3Sn significantly and increased the ratio of Kirkendall voids to the total area of Cu3Sn layer. However, the Kirkendall effect seems to have no obvious influence on the fracture features of Ni/ Sn3Ag0.5Cu /Cu joints compared with Cu/Sn3Ag0.5Cu/Cu joint by using lap-shear test method.
Keywords :
copper; couplings; electronics packaging; fracture toughness; nickel; semiconductor device reliability; shearography; silver compounds; size effect; solders; tin compounds; Cu3Sn; Krikendall voids; Ni-Sn3.0Ag0.5Cu-Cu; coupling effect; fracture features; joint size; lap-shear test method; size effect; Aging; Couplings; Joints; Nickel; Reliability; Soldering; Tin; Kirkendall voids; coupling effect; fracture feature; size effect;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922619
