• DocumentCode
    1182566
  • Title

    Analysis and evaluation of multisite testing for VLSI

  • Author

    Hashempour, Hamidreza ; Meyer, Fred J. ; Lombardi, Fabrizio

  • Author_Institution
    IC Dev. & Appl. Res., LTX Corp., San Jose, CA, USA
  • Volume
    54
  • Issue
    5
  • fYear
    2005
  • Firstpage
    1770
  • Lastpage
    1778
  • Abstract
    This paper deals with multisite testing of VLSI chips in a manufacturing environment. Multisite testing is analyzed and evaluated using device-under-test (DUT) parameters (such as yield and average number of faults per DUT) as well as test process features (such as number of channels, fault coverage, and touchdown time for the head). The presence of idle time periods and their impact on the multisite test time is analyzed in depth. Two hybrid testing scenarios which combine built-in self-test (BIST) and automatic test equipment (ATE) are proposed and analytical models are provided to establish the corresponding multisite test time. It is shown that a hybrid approach based on screening chips through a BIST stage improves the performance of multisite test and allows a better utilization of channels in the head of an ATE.
  • Keywords
    VLSI; automatic test equipment; built-in self test; integrated circuit testing; integrated circuit yield; ATE; BIST; DUT; VLSI; automatic test equipment; built-in self-test; device-under-test; fault coverage; hybrid testing; multisite testing; Automatic test equipment; Automatic testing; Built-in self-test; Circuit faults; Circuit testing; Fault diagnosis; Integrated circuit testing; Radio frequency; Radiofrequency identification; Very large scale integration; Automatic test equipment (ATE); built-in self test (BIST); fault coverage; multisite testing; yield;
  • fLanguage
    English
  • Journal_Title
    Instrumentation and Measurement, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9456
  • Type

    jour

  • DOI
    10.1109/TIM.2005.855099
  • Filename
    1514625