The improvement of soldering process of new power module packaging material with large soldering area

With the development of materials technology, more and more high-performance materials can be used for power modules. DBC(Direct Bonded Copper) ceramic plates and Al-SiC composite are two most excellent materials among them. DBC power circuit board + AlSiC composite shell is a very good solution to form the thermal path of the power modules. Because the characteristics of the materials, the module is lighter, more reliable and have higher power density. This paper focus on the application of new materials in power modules, improve the solder process to meet the requirements of the actual products, which´s solder area mostly larger than 50mm×50mm.