Method for determining the junction temperature of alternating current light-emitting diodes

A numerical simulation was used to simulate the temperature distribution during AC and DC operations of an alternating current light-emitting diode (AC LED). The relationship between the junction temperature and the temperature at the centre of the bottom surface of the submount of an AC LED was measured under DC operation. This relationship was confirmed by numerical simulation. The numerical results were consistent with the experimental observations in that the temperature at the centre of the bottom surface of the submount was insensitive to the current variations that occur in an AC LED, probably because of the large mass of the submount. However, it was difficult to measure the temperature oscillation at the junctions in an AC LED, although this oscillation can be clearly seen in the numerical results. Thus, the authors propose a formula for predicting the range of the oscillating junction temperature for an AC LED.