DocumentCode :
118328
Title :
Study on the bridge effect of graphene oxide on thermal conductivity of Al2O3 filled glass fibers reinforced polymer composites
Author :
Yimin Yao ; Xiaoliang Zeng ; Rong Sun ; Jianbin Xu
Author_Institution :
Shenzhen Electron. Packaging Mater. Eng. Lab., Shenzhen Inst. of Adv. Technol., Shenzhen, China
fYear :
2014
fDate :
12-15 Aug. 2014
Firstpage :
296
Lastpage :
300
Abstract :
Al2O3 particles linked by graphene oxide sheets (GO-linked Al2O3), were fabricated via self-assembly leading by electrostatic attraction and incorporated into the glass fibers reinforced polymer composites (GFRPC) to improve their thermal conductivities. Flexible and ultrathin GO sheet was able to bridge adjacent Al2O3 particles, which would contribute to form thermally conductive pathways. Addition of GO sheets resulted in great enhancement of thermal conductivity with the highest value of 0.95 W/m·K, which was increased by 37.6 % compared to composite with raw Al2O3. Moreover, the dielectric constant and loss increased for adding GO sheets exacerbated interfacial polarization. The study will provide new guide for preparing high thermally conductive GFRPC.
Keywords :
alumina; electronics packaging; filled polymers; glass fibre reinforced composites; graphene; permittivity; self-assembly; sheet materials; thermal conductivity; Al2O3; bridge effect; dielectric constant; electrostatic attraction; exacerbated interfacial polarization; filled glass fibers reinforced polymer composites; flexible GO sheet; graphene oxide; graphene oxide sheets; high thermally conductive GFRPC; self-assembly; thermal conductivity pathways; ultrathin GO sheet; Aluminum oxide; Bridges; Conductivity; Electronic packaging thermal management; Polymers; Thermal conductivity; Thermal resistance; alumina; bridge effect; glass fibers reinforced polymer composites; graphene oxide; thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
Type :
conf
DOI :
10.1109/ICEPT.2014.6922658
Filename :
6922658
Link To Document :
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