Effect of SiC whiskers addition on microstructure, microhardness and wettablility of Sn-Ag-Cu solder

Author

Kaisheng Xu ; Guang Chen ; Fengshun Wu ; Weisheng Xia ; Hui Liu

Author_Institution

Coll. of Mater. Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China

fYear

2014

fDate

12-15 Aug. 2014

Firstpage

310

Lastpage

312

Abstract

A novel SiC doped SAC305 composite solder was developed by mechanically mixing various amount of the SiC whiskers with Sn-3.0Ag-0.5Cu solder paste. The effect of SiC whiskers addition on microstructure, microhardness and wettability of the composite solders was investigated. It was found that the eutectic structure was refined in the composite solder, and both of the microhardness and wettability of the composite solders were improved. Specifically, 0.1 wt.% of SiC whiskers addition in composite solder lead to 29.2% increase in hardness while 0.2 wt.% of SiC whiskers addition cause a 6.3% decrease in the contact angle.

Keywords

contact angle; copper alloys; crystal microstructure; microhardness; silicon compounds; silver alloys; solders; tin alloys; wetting; whiskers (crystal); wide band gap semiconductors; SAC305 composite solder; SiC; Sn-Ag-Cu solder; SnAgCu; composite solders; contact angle; eutectic structure; microhardness; microstructure; wettablility; whiskers addition; Aluminum oxide; Lead; Materials; Microstructure; Nanoparticles; Silicon carbide; Composite solder; Microhardness; Microstructure; Wettability;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2014 15th International Conference on

Conference_Location

Chengdu

Type

conf

DOI

10.1109/ICEPT.2014.6922661

Filename

6922661