DocumentCode :
118340
Title :
Calculation of effective thermal conductivity of silicone matrix embedded with particulate phosphors in white led packages by 2D/3D unit cell method
Author :
Run Hu ; Chao Yuan ; Xiaobing Luo ; Ting Cheng ; Sheng Liu
Author_Institution :
Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear :
2014
fDate :
12-15 Aug. 2014
Firstpage :
324
Lastpage :
328
Abstract :
The effective thermal conductivity (ETC) of silicone matrix embedded with particulate phosphors is of great importance in the thermal management of white light-emitting diode (LED) packages, not only because the mixture provides the heat dissipation path but also because the phosphors may generate heat as well. In this paper, a 2D/3D unit cell method with considering interface resistance was proposed to calculate the ETC of the silicone matrix embedded with particulate phosphors. To make the method more general, cubic, spherical and cylindrical particulate phosphors were calculated and discussed respectively. In order to validate the method, hot wire method was used to measure the thermal conductivity of phosphor silicone matrix. It is found that when the volume concentration increases from 0.038 to 0.25, the relative error between the experiments and calculations is within 5%. The ETC calculated by 2D model is slightly smaller than that by 3D model. The 3D model has relatively smaller critical concentration because the probability of forming continuous conductive chain by phosphor particles is lager in the 3D model than the 2D model. The shape of particle affect the ETC and the effect becomes more obvious at large concentration. The heat generated by phosphor particles is found to have no effect on the ETC.
Keywords :
cooling; light emitting diodes; phosphors; silicones; thermal conductivity; thermal management (packaging); 2D-3D unit cell method; ETC; continuous conductive chain; cubic particulate phosphors; cylindrical particulate phosphors; effective thermal conductivity; heat dissipation path; hot wire method; interface resistance; light-emitting diode; silicone matrix; spherical particulate phosphors; thermal management; volume concentration; white LED packages; Conductivity; Heating; Light emitting diodes; Phosphors; Solid modeling; Thermal conductivity; Three-dimensional displays; Effective thermal conductivity; Percolation; Phosphor particle; Unit cell;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
Type :
conf
DOI :
10.1109/ICEPT.2014.6922665
Filename :
6922665
Link To Document :
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