DocumentCode :
118341
Title :
Enhancing the thermal conductivity of silicone composites by increasing crosslink degree
Author :
Jie Li ; Xinfeng Zhang ; Yuen, Matthew Ming-Fai ; Kai Zhang ; Liu, L. ; Cheng Sheng Ku
Author_Institution :
Dept. of Mech. & Aerosp. Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong, China
fYear :
2014
fDate :
12-15 Aug. 2014
Firstpage :
329
Lastpage :
333
Abstract :
In this contribution, for the first time, the effect of crosslink degree on the thermal conductivity of silicone-based thermal conductive materials has been experimentally investigated. Hyper-branched silicone bases with different branching degrees and cross-linkable functional group densities are designed and synthesized via a one-pot, simple and efficient route. The resulting silicone bases can be efficiently cured by the agents containing the silicone-hydrogen functional group under the catalysis of platinum complex, giving hard and relatively brittle solids, rather than soft elastomer-like products obtained from commercial silicones with much lower crosslink density. Interestingly, with increasing the loading ratio of ceramic nanoparticles, the composites with the homemade silicones as the base become very stiff, and exhibit much higher thermal conductivity than the commercial ones with up to 50% enhancement, although the thermal conductivity of pure self-made silicones is similar to that of commercial silicones. This can be attributed to more energy transfer pathways along covalent bonding and reduced free volume in the composites with higher crosslink degree, demonstrating an effective approach to enhance the thermal conductivity of silicone-based thermal conductive materials. By using our self-made silicones, a novel thermal conductive material with both good transparency and high thermal conductivity has been developed potentially for die attach materials and LED encapsulants.
Keywords :
composite materials; elastomers; nanoparticles; silicones; thermal conductivity; LED encapsulants; branching degrees; brittle solids; ceramic nanoparticles; covalent bonding; cross-linkable functional group density; crosslink degree effect; crosslink density; die attach materials; energy transfer pathways; hyper-branched silicone bases; loading ratio; platinum complex catalysis; reduced free volume; silicone composites; silicone-based thermal conductive materials; soft elastomer-like products; Conductivity; Electronic packaging thermal management; Light emitting diodes; Polymers; Thermal conductivity; Thermal stability; crosslink degree; silicone; thermal coductive materials; thermal conductivity; transparency;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
Type :
conf
DOI :
10.1109/ICEPT.2014.6922666
Filename :
6922666
Link To Document :
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