DocumentCode :
118371
Title :
Investigating the rheological and thermomechanical properties of SiO2/epoxy nanocomposites: Probing the role of silane coupling agent
Author :
Gang Li ; Pengli Zhu ; Liang Huang ; Tao Zhao ; Rong Sun ; Daoqiang Lu
Author_Institution :
Shenzhen Inst. of Adv. Technol., Shenzhen, China
fYear :
2014
fDate :
12-15 Aug. 2014
Firstpage :
391
Lastpage :
395
Abstract :
In our study, three different silane coupling agents with various functional groups, (y-aminopropyl) triethoxysilane (KH550), γ-(2,3-epoxypropoxy) propytrimethoxysilane (KH560) and trimethoxyoctadecylsilane (TMOS) were added into the SiO2/epoxy composites respectively, and their effects on the rheological and thermomechanical properties of nanocomposites were investigated systematically. The incorporation of coupling agents alter the rheological properties of nanocomposites depending on functional group of the silane which is responsible for interacting with the polymer matrix, and the viscosities were increased by the addition of coupling agents except for the KH560 coupling agent. In addition, the incorporation of coupling agents into epoxy matrix decreased the cross-link densities of nanocomposites due to the “plastic effect” of coupling agents, which consequently leaded to poorer thermal stabilities, increased glass transition temperatures (Tg) and coefficient of thermal expansion (CTE) of nanocomposites as evidenced from TGA, DMA and TMA, respectively. We believe that the different structures of coupling agents as well as their corresponding filler-matrix interfacial interactions are responsible for the resulting properties of nanocomposites.
Keywords :
electronics packaging; glass transition; nanocomposites; resins; rheology; thermal analysis; thermal expansion; thermal stability; viscosity; γ-(2,3-epoxypropoxy) propytrimethoxysilane; (y-aminopropyl) triethoxysilane; CTE; DMA; KH550; KH560; TGA; TMA; TMOS; coefficient-of-thermal expansion; coupling agent structures; cross-link density; dynamic mechanical analysis; filler-matrix interfacial interactions; functional groups; glass transition temperatures; nanocomposite properties; plastic effect; polymer matrix; rheological properties; silane coupling agent role; silicon dioxide-epoxy nanocomposites; thermal stability; thermogravimetric analysis; thermomechanical analyzer; thermomechanical properties; trimethoxyoctadecylsilane; viscosity; Couplings; Epoxy resins; Nanocomposites; Polymers; Silicon compounds; Thermal stability; Viscosity; SiO2/epoxy composites; interfacial interactions; rheological and thermomechanical properties; silane coupling agents;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
Type :
conf
DOI :
10.1109/ICEPT.2014.6922680
Filename :
6922680
Link To Document :
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