Title :
Research on tensile property and creep resistance of electroplating nickel reinforced by A12O3 nanoparticles
Author :
Chunjin Hang ; Yanhong Tian ; Chunqing Wang ; Hong Wang
Author_Institution :
State Key Lab. of Adv. Welding & Joining, Harbin Inst. of Technol., Harbin, China
Abstract :
In this work, the tensile property and creep behavior of electrodeposited nanostructure Al2O3-Ni composite coatings have been investigated. The nanocomposite coatings were produced by composite electrodeposition technique in a nickel sulphamate bath containing suspended nano-sized Al2O3 particles. The structure of the obtained coatings was characterized by scanning electron microscopy (SEM), and the Al2O3 content was analyzed from quantitative energy dispersive X-ray spectrometry (EDX). It has been found that the existence of Al2O3 particles disturbed the law of nickel deposition and decreased the grain size of nickel film. The tensile test showed an apparent increase in the strength of composite nickel coatings as compared with that of pure nickel coatings. Also the steady state creep rate of the composite nickel is lower than that of the pure nickel, which illustrated that the creep resistance was improved by adding Al2O3 nanoparticles as the dispersion strengthened second-phase.
Keywords :
X-ray chemical analysis; aluminium compounds; creep; electroplating; grain size; nanocomposites; nanoparticles; nickel alloys; scanning electron microscopy; tensile testing; yield strength; Al2O2; EDX; Ni; SEM; composite electrodeposition technique; creep resistance; dispersion strengthened second-phase; electrodeposited nanostructure; electroplating nickel; film grain size; nanocomposite coatings strength; nickel sulphamate bath; quantitative energy dispersive X-ray spectrometry; scanning electron microscopy; steady state creep rate; suspended nanosized particles; tensile property; tensile strength; tensile test; yield strength; Al2O3 nanoparticles; creep resistance; electroplating nickel; tensile property;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922699