DocumentCode
118423
Title
Research on tensile property and creep resistance of electroplating nickel reinforced by A12 O3 nanoparticles
Author
Chunjin Hang ; Yanhong Tian ; Chunqing Wang ; Hong Wang
Author_Institution
State Key Lab. of Adv. Welding & Joining, Harbin Inst. of Technol., Harbin, China
fYear
2014
fDate
12-15 Aug. 2014
Firstpage
476
Lastpage
479
Abstract
In this work, the tensile property and creep behavior of electrodeposited nanostructure Al2O3-Ni composite coatings have been investigated. The nanocomposite coatings were produced by composite electrodeposition technique in a nickel sulphamate bath containing suspended nano-sized Al2O3 particles. The structure of the obtained coatings was characterized by scanning electron microscopy (SEM), and the Al2O3 content was analyzed from quantitative energy dispersive X-ray spectrometry (EDX). It has been found that the existence of Al2O3 particles disturbed the law of nickel deposition and decreased the grain size of nickel film. The tensile test showed an apparent increase in the strength of composite nickel coatings as compared with that of pure nickel coatings. Also the steady state creep rate of the composite nickel is lower than that of the pure nickel, which illustrated that the creep resistance was improved by adding Al2O3 nanoparticles as the dispersion strengthened second-phase.
Keywords
X-ray chemical analysis; aluminium compounds; creep; electroplating; grain size; nanocomposites; nanoparticles; nickel alloys; scanning electron microscopy; tensile testing; yield strength; Al2O2; EDX; Ni; SEM; composite electrodeposition technique; creep resistance; dispersion strengthened second-phase; electrodeposited nanostructure; electroplating nickel; film grain size; nanocomposite coatings strength; nickel sulphamate bath; quantitative energy dispersive X-ray spectrometry; scanning electron microscopy; steady state creep rate; suspended nanosized particles; tensile property; tensile strength; tensile test; yield strength; Al2 O3 nanoparticles; creep resistance; electroplating nickel; tensile property;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location
Chengdu
Type
conf
DOI
10.1109/ICEPT.2014.6922699
Filename
6922699
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