Effect of CuO on laser absorption in glass to glass laser bonding

Localized laser bonding using a glass frit intermediate layer is an ideal technology to hermetically package miniature devices without heating the function components. It is important to describe the laser energy transmission and absorption in glass frit when modeling heat transfer in transmission laser bonding of glass to glass. Excess energy leads to over-burning of the glass material and deficit energy produces weak bonding. In this paper, the effect of CuO as additive in glass frit is investigated. The research shows that the content of CuO is confirmed to have direct influence on the laser absorption and the bonding quality. Shear force test, SEM and EDX analysis are used to survey the bonding quality. After a series of experiment and analysis, we found that adding 15% CuO can get a best result of encapsulation. Within the scope of this add, the glass frit could meet the needs of packaging.