DocumentCode
1184468
Title
The fundamentals of aging in HV polymer-film capacitors
Author
Reed, C.W. ; Cichanowski, S.W.
Author_Institution
Corp. Res. & Dev., Gen. Electr. Co., Schenectady, NY, USA
Volume
1
Issue
5
fYear
1994
fDate
10/1/1994 12:00:00 AM
Firstpage
904
Lastpage
922
Abstract
This paper covers the basic phenomena involved in the aging of capacitors constructed using polymer films as the major dielectric material. A wide variety of aging phenomena can be identified, ranging from simple electrical, dielectric, thermal, radiation, chemical and physical aging, to aging originating from the specific construction of the capacitor. Some phenomena occur quickly, such as some morphological changes in the polymer, others occur progressively, and others occur later in the life of the capacitor. The polymers covered range from biaxially-oriented polypropylene, which is widely used in commercial utility and industrial capacitors, to polymers like polycarbonate, polysulfone, polyimide, and polyvinylidene fluoride, which are used in high-energy density, outer-space, high-temperature, or other special applications. The paper addresses two constructions of polymer film capacitor where the aging phenomena are significantly different due to the differences in construction: polymer/foil capacitors and metalized film capacitors. Metalized polymer film capacitors have the quality of clearing or self healing that is not present in film/foil capacitors. The discussion of aging in this paper is given from the perspective of these two designs
Keywords
ageing; high-voltage engineering; polymer films; power capacitors; HV polymer-film capacitors; aging; biaxially-oriented polypropylene; clearing; dielectric material; metalized film capacitors; morphology; polycarbonate; polyimide; polymer/foil capacitors; polysulfone; polyvinylidene fluoride; self healing; Aging; Aluminum; Capacitors; Chemicals; Dielectrics; Electric breakdown; Electrodes; Polymer films; Research and development; Thermal stresses;
fLanguage
English
Journal_Title
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher
ieee
ISSN
1070-9878
Type
jour
DOI
10.1109/94.326658
Filename
326658
Link To Document