DocumentCode
118493
Title
Utilizing plating bar structure to enhance passive equalizer compensation technique
Author
Chen-Chao Wang ; Hung-Chun Kuo ; Fu-Chen Chu ; You-Le Lin ; Tsai-Yun Hsieh ; Chi-Tsung Chiu ; Chih-Pin Hung ; Sheng-Hua Huang ; Chih-Wen Kuo
Author_Institution
Corp. Design Div., Adv. Semicond. Eng. Inc., Kaohsiung, Taiwan
fYear
2014
fDate
12-15 Aug. 2014
Firstpage
573
Lastpage
576
Abstract
In this paper, an open-stub compesation technique is proposed for passive equalizers used in high-speed digital communication systems. By simply lumping an open-stub to the conventional RL-type passive equalizer, the frequency-dependent channel loss from the long transmission path can be compensated, the frequency response of the channel becomes more flat and the bandwidth is wider. Compared proposed passive equalizer with typical RL passive equalizers, the simulation result shows this technique can improve 1 GHz in the flat region of S21 on a 60cm long differential pair. This technique is successfully demonstrated the improvement of electrical performance about 57.4% on time domain.
Keywords
UHF circuits; compensation; digital communication; equalisers; frequency response; passive networks; RL-type passive equalizer; differential pair; frequency 1 GHz; frequency response; frequency-dependent channel loss; high-speed digital communication systems; long transmission path; open-stub compensation technique; passive equalizer compensation technique; plating bar structure; size 60 cm; time domain; Bandwidth; Data communication; Electronics packaging; Equalizers; Frequency response; Impedance; Time-domain analysis; Passive equalizer; eye opening; frequence-dependent loss; intersymbol interference (ISI); open stub;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location
Chengdu
Type
conf
DOI
10.1109/ICEPT.2014.6922721
Filename
6922721
Link To Document