Studies on thermally strain relieving behavior of ring configurations for a packaged SAW device chip

With the growing of the applications of surface acoustic wave (SAW) devices, the requirement for the accuracy of the operating frequency of the SAW devices is constantly strengthened. The impact of thermal strain on the characteristics of SAW devices cannot be ignored, which induced in their packaging process. In this paper, by using the finite element method (FEM) software, the thermal strain induced in the F-11 package structure of a SAW device is analyzed. An approach to reduce the thermal strain induced in the device chip by setting a ring configuration around it is explored. And the effects of various ring structures with different materials, thicknesses, widths and other parameters for reducing the thermal strain on the chip surface are analyzed and compared.