Determination of solder/Cu interfacial cohesive zone model parameters by inverse analysis

Author

Guohui Jin ; Pengwei Wu ; Yangjian Xu ; Lihua Liang ; Xiaogui Wang ; Yong Liu

Author_Institution

Fairchild-ZJUT Microelectron. Packaging Joint Lab., Zhejiang Univ. of Technol., Hangzhou, China

fYear

2014

fDate

12-15 Aug. 2014

Firstpage

610

Lastpage

614

Abstract

An inverse analysis based on a modified Kalman filter algorithm (KFA) was carried out to identify mode-I parameters of a cohesive zone model (CZM) for simulating solder interfacial failure in electronic packaging components. The exponential cohesive law was investigated here and its cohesive parameters were determined in two steps by approaching the finite element simulation results to the experimental information. The simulation result based on the identified CZM parameters shows that the present inverse procedure is effective and promising to identify the exponential types of CZM parameters.

Keywords

Kalman filters; copper; electronics packaging; finite element analysis; solders; electronic packaging components; exponential cohesive law; finite element simulation; interfacial cohesive zone model parameters; inverse analysis; modified Kalman filter algorithm; solder interfacial failure; Analytical models; Covariance matrices; Inverse problems; Load modeling; Parameter estimation; White noise; DCB specimen; cohesive zone model; inverse analysis; parameters identification;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2014 15th International Conference on

Conference_Location

Chengdu

Type

conf

DOI

10.1109/ICEPT.2014.6922730

Filename

6922730