Title :
Low-Cost RFID Threshold Shock Sensors
Author :
Todd, Benjamin ; Phillips, Mallory ; Schultz, Stephen M. ; Hawkins, Aaron R. ; Jensen, Brian D.
Author_Institution :
Dept. of Mech. Eng., Brigham Young Univ., Provo, UT
fDate :
4/1/2009 12:00:00 AM
Abstract :
This paper describes a battery-free threshold shock sensor with wireless readout via RFID circuitry. The entire package is designed to provide low-cost sensors for monitoring shock loads in applications such as shipping. The sensor is based on a mechanical bistable mechanism laser-cut from a single Delrin layer which switches states when exposed to accelerations above a threshold. The sensor was tested using quasi-static accelerations in a centrifuge, pulsed accelerations from an impact event, and vibration (sinusoidal) accelerations on a shaker table. Measured threshold accelerations were similar in magnitude for the three load types, although they varied slightly due to dynamic effects. This phenomenon was further explored using a dynamic model of the sensor. Threshold accelerations in the range of 30-50 G´s were measured, and these values can be varied by changing the mass of the accelerometer´s outer frame. Wireless readout was successfully demonstrated by using the mechanical accelerometer as an electrical switch connected to the sensor input of an RFID chip.
Keywords :
accelerometers; radiofrequency identification; shock measurement; Delrin layer; RFID chip; battery-free threshold shock sensor; electrical switch; impact event; low-cost RFID threshold shock sensors; mechanical accelerometer; mechanical bistable mechanism; pulsed accelerations; quasi-static accelerations; shaker table; shock loads monitoring; vibration accelerations; wireless readout; Acceleration; Circuits; Electric shock; Life estimation; Mechanical sensors; Packaging; Radiofrequency identification; Sensor phenomena and characterization; Switches; Wireless sensor networks; Radio frequency Identification (RFID); shock sensor; wireless sensing;
Journal_Title :
Sensors Journal, IEEE
DOI :
10.1109/JSEN.2009.2014410