Title :
Study of response time of a micro flow sensor
Author :
Xing Guo ; Chunlin Xu ; Qiang Dan ; Shengzhi Zhang ; Sheng Liu
Author_Institution :
Sch. of Mech. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
Abstract :
In this paper, simulation model for the response time of micro flow sensor using COMSOL Multiphysics is presented. The detailed structure of the micro flow sensor chip is considered in the simulation model. What´s more, the temperature dependencies of physical properties of air are defined to improve the model precision. The model takes into consideration the transient conduction and convection between the sensor structure and fluid region. The effects of mass flow rate, thermistor position, input power and depth of flow channel on the response time of the micro flow sensor are investigated in detail. The effect of air relative humidity on the response time of the micro flow sensor is also studied. The results show the geometry parameters are the main factors that affect the response time.
Keywords :
convection; flow sensors; heat conduction; humidity measurement; mass measurement; microsensors; position measurement; power measurement; temperature measurement; thermistors; time measurement; COMSOL Multiphysics; air physical property; air relative humidity effect; depth measurement; flow channel; mass flow effect; micro flow sensor chip; power measurement; thermistor position; time measurement; transient conduction; transient convection; Atmospheric modeling; Heating; Humidity; Mathematical model; Temperature sensors; Thermistors; Time factors; air relative humidity; micro flow sensor; modeling; response time;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922739