DocumentCode :
1185489
Title :
Polymer-based wide-bandwidth and high-sensitivity micromachined electron tunneling accelerometers using hot embossing
Author :
Cui, Tianhong ; Wang, Jing
Author_Institution :
Dept. of Mech. Eng., Univ. of Minnesota, Minneapolis, MN, USA
Volume :
14
Issue :
5
fYear :
2005
Firstpage :
895
Lastpage :
902
Abstract :
The first PMMA-based membrane tunneling accelerometers were fabricated by hot embossing replication with silicon molds. The silicon molds were prepared by a combinative etching technique involving anisotropic bulk etching and modified plasma dry etching. The constructed molds hold both pyramid pits and positive profile sidewalls with smooth surfaces and steep angles, which were necessary for the hot embossing demolding. After electrodes patterned on embossed PMMA structures, the accelerometers, 8 mm ×8 mm ×1 mm, were packaged and assembled on a measurement circuit board. The exponential relationship between tip currents and applied deflection voltages presented a tunneling barrier height of 0.17 eV. The natural frequency of sensors was about 128 Hz. The bandwidth of the feedback system was 6.3 kHz. The sensitivity of voltage over acceleration was 20.6 V/g, and the resolution was 0.2485 μg/√Hz (g=9.8 m/s2).
Keywords :
accelerometers; embossing; micromachining; microsensors; moulding; polymers; replica techniques; sputter etching; tunnelling; 0.17 eV; 1 mm; 6.3 kHz; 8 mm; PMMA-based membrane tunneling accelerometers; anisotropic bulk etching; applied deflection voltages; embossed PMMA structures; high-sensitivity micromachined electron tunneling accelerometers; hot embossing demolding; hot embossing replication; modified plasma dry etching; polymer-based wide-bandwidth accelerometers; positive profile sidewalls; pyramid pits; silicon molds; tip currents; Accelerometers; Biomembranes; Dry etching; Electrons; Embossing; Plasma measurements; Polymers; Silicon; Tunneling; Voltage; Accelerometer; MEMS; PMMA; electron tunneling; hot embossing;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2005.851865
Filename :
1516171
Link To Document :
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