• DocumentCode
    1185980
  • Title

    Coupled mode analysis of forward and backward coupling in multiconductor transmission lines

  • Author

    Chen, Dengpeng ; Shen, Zhongxiang ; Lu, Yilong

  • Author_Institution
    Agilent Technol., Singapore, Singapore
  • Volume
    47
  • Issue
    3
  • fYear
    2005
  • Firstpage
    463
  • Lastpage
    470
  • Abstract
    The nonorthogonal coupled mode theory is extended to the analysis of multiconductor transmission lines by including backward coupling. Coupling coefficients are expressed as overlap integrals of the eigenfields and currents belonging to individual lines. These eigenmode solutions are calculated using the finite-difference time-domain method, which can provide a broadband solution through a single simulation. General termination conditions are given, and scattering parameters of a multiconductor transmission line can be obtained directly by solving the coupled mode equations subject to these termination conditions. As illustrative examples, several configurations of coupled microstrip lines are analyzed, and numerical results are presented. It is observed that both the forward and backward coupling results agree fairly well with results from Advanced Design System Momentum software.
  • Keywords
    S-parameters; coupled mode analysis; eigenvalues and eigenfunctions; finite difference time-domain analysis; multiconductor transmission lines; advanced design system momentum software; backward coupling; coupled microstrip lines; coupled mode analysis; coupled mode equations; eigenmode solutions; finite difference time-domain method; forward coupling; multiconductor transmission lines; nonorthogonal coupled mode theory; scattering parameters; Coupled mode analysis; Couplings; Equations; Finite difference methods; Microstrip; Multiconductor transmission lines; Scattering parameters; Software design; Software systems; Time domain analysis; Coupled mode analysis; coupled transmission lines; scattering parameters;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2005.850675
  • Filename
    1516217