Electromagnetic noise coupling analysis of TSV array by using cylindrical mode expansion method

Author

Jun Li ; Hui-Chun Yu ; Xing-Yun Luo ; Xiao-Bo Huang ; Xing-Chang Wei ; Er-Ping Li

Author_Institution

Dept. of Inf. Sci. & Electron. Eng., Zhejiang Univ., Hangzhou, China

fYear

2014

fDate

12-15 Aug. 2014

Firstpage

753

Lastpage

756

Abstract

A semi-analytic approach for the electromagnetic analysis of large numbers of Through silicon vias (TSV) is presented in this paper. The method is based on cylindrical mode expansion method. The scattering and multi reflection effects between the vertical cylindrical vias are considered by expanding the electromagnetic waves surrounding the vias by cylindrical waves. As the method fully captured the physical mechanism of the wave interaction between multiple vias, it can give a high accuracy and fast solution. Based on this method, the effect of the shielding TSVs for the reduction of electromagnetic interference is efficiently analyzed.

Keywords

coupled circuits; electromagnetic coupling; integrated circuit noise; interference suppression; three-dimensional integrated circuits; TSV array; cylindrical mode expansion method; cylindrical wave; electromagnetic interference reduction; electromagnetic noise coupling analysis; electromagnetic wave expansion; multireflection effect; scattering effect; shielding TSV; through silicon vias; vertical cylindrical vias; wave interaction; Arrays; Couplings; Electromagnetic interference; Silicon; Substrates; Three-dimensional displays; Through-silicon vias; Through silicon vias (TSV); cylindrical mode expansion; electromagnetic interference analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2014 15th International Conference on

Conference_Location

Chengdu

Type

conf

DOI

10.1109/ICEPT.2014.6922759

Filename

6922759