Study on encapsulation reliability

Interface delamination is one major reliability problem that may lead to multi-material structures products failure in microsystems package. To ensure the package reliability and to provide guidelines for package design and manufacture, a series of experiments are designed to study the adhesive strength between substrate and molding compound (MC) through charging molding parameters. On the other hand, the adhesive strength, disposed by Moisture sensitivity level 3(MSL3) and reflowed three times at 260 centigrade, is investigated. Finally, some details related with package design and manufacture are given out for reference.