DocumentCode
118642
Title
Microwave multichip module tridimensional assembly technology based on LTCC
Author
Zhang, Tianzhu
Author_Institution
Aerosp. Electron. Manuf. Center, Acad. of Space Electron. Inf. Technol., Xi´an, China
fYear
2014
fDate
12-15 Aug. 2014
Firstpage
811
Lastpage
814
Abstract
With the evolution of microwave substrate, microwave multichip modules are developing towards multilayer. Combined with SMT, high-precision chip assembly, circuit connection, anti-influence partition soldering, module integration technology and so on, those multilayer products constructed by utilizing LTCC technology are attractive candidates to satisfy the demand for telecommunication systems with miniaturized size, intergrated structure and light weight.
Keywords
assembling; ceramic packaging; microwave circuits; multichip modules; multilayers; surface mount technology; LTCC technology; SMT; antiinfluence partition soldering; circuit connection; high-precision chip assembly; microwave multichip module tridimensional assembly technology; microwave substrate evolution; module integration technology; multilayer product; telecommunication system; Assembly; Microwave circuits; Microwave filters; Substrates; Three-dimensional displays; LTCC; multichip module; tridimensional assembly;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location
Chengdu
Type
conf
DOI
10.1109/ICEPT.2014.6922772
Filename
6922772
Link To Document