Title :
Back drilling in high-speed interconnect system
Author :
Xu Wang ; Weidong Ding
Author_Institution :
Res. Inst. of Electron. Sci. & Technol., UESTC, Chengdu, China
Abstract :
In recent years, power noise, switching noise (SSN), jitter and so on are gradually becoming the hot research issues in high-speed interconnect system with the signal rate rising. At the same time, the resonance distributing in the Printed Circuit Board (PCB) may also lead to the instability of the signals. Because of the high speed of the signals, the model of the PCB vias is no longer the simple channel connection with the different layers, otherwise it will destroy the continuous impedance of the signals. So Electro-Magnetic Interference (EMI) will occur as a result of discontinuous impedance in the PCB. In this paper, we propose a new way which calls back drilling to avoid the resonance and optimize the signal performance.
Keywords :
circuit noise; drilling; electromagnetic interference; jitter; printed circuit interconnections; switching circuits; EMI; PCB; SSN; back drilling; channel connection; discontinuous impedance; electromagnetic interference; high-speed interconnect system; jitter; power noise; printed circuit board; signal instability; switching noise; Analytical models; Impedance; Inductance; Integrated circuit interconnections; Parasitic capacitance; Time-domain analysis; EMI; back drilling; high-speed; interconnect;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922775