DocumentCode
1186495
Title
Impact of the interaction between nitrogen implant and NO anneal on narrow-width transistors
Author
Gopinath, Venkatesh P. ; Kamath, Arvind ; Mirabedini, Mohammad ; Hornback, Verne ; Le, Ynhi ; Badowski, Alfred ; Yeh, Wen-Chin
Author_Institution
Process & Technol. Dev., LSI Logic Corp., Santa Clara, CA, USA
Volume
24
Issue
2
fYear
2003
Firstpage
66
Lastpage
68
Abstract
This study reports a new behavior in narrow-width transistors resulting from the interaction of oxides grown with nitrogen implant with the nitridation associated with growing other oxides. Nitric oxide (NO) annealing of 28-/spl Aring/ oxides grown on nitrogen-implanted silicon results in the decrease of NMOS threshold voltage and in the increase (absolute value) of PMOS threshold with decreasing width. This effect arises from the positive charge from NO anneal interacting with the parasitic transistor associated with the shallow trench isolation edge recess. The parasitic impact becomes more pronounced for narrower widths due to higher effect of recess on total transistor width.
Keywords
MOSFET; annealing; ion implantation; isolation technology; nitridation; oxidation; 28 A; CMOS narrow-width transistors; N implant; NMOS threshold voltage; NO; NO annealing; PMOS threshold; Si:N; Si:N-SiO/sub 2/; narrow-width effect; nitridation; oxide interaction; parasitic impact; parasitic transistor; positive charge; shallow trench isolation edge recess; total transistor width; Annealing; Implants; Large scale integration; Lead compounds; Logic; MOS devices; Nitrogen; Oxidation; Silicon; Surface resistance;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2002.808157
Filename
1196018
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