• DocumentCode
    1186495
  • Title

    Impact of the interaction between nitrogen implant and NO anneal on narrow-width transistors

  • Author

    Gopinath, Venkatesh P. ; Kamath, Arvind ; Mirabedini, Mohammad ; Hornback, Verne ; Le, Ynhi ; Badowski, Alfred ; Yeh, Wen-Chin

  • Author_Institution
    Process & Technol. Dev., LSI Logic Corp., Santa Clara, CA, USA
  • Volume
    24
  • Issue
    2
  • fYear
    2003
  • Firstpage
    66
  • Lastpage
    68
  • Abstract
    This study reports a new behavior in narrow-width transistors resulting from the interaction of oxides grown with nitrogen implant with the nitridation associated with growing other oxides. Nitric oxide (NO) annealing of 28-/spl Aring/ oxides grown on nitrogen-implanted silicon results in the decrease of NMOS threshold voltage and in the increase (absolute value) of PMOS threshold with decreasing width. This effect arises from the positive charge from NO anneal interacting with the parasitic transistor associated with the shallow trench isolation edge recess. The parasitic impact becomes more pronounced for narrower widths due to higher effect of recess on total transistor width.
  • Keywords
    MOSFET; annealing; ion implantation; isolation technology; nitridation; oxidation; 28 A; CMOS narrow-width transistors; N implant; NMOS threshold voltage; NO; NO annealing; PMOS threshold; Si:N; Si:N-SiO/sub 2/; narrow-width effect; nitridation; oxide interaction; parasitic impact; parasitic transistor; positive charge; shallow trench isolation edge recess; total transistor width; Annealing; Implants; Large scale integration; Lead compounds; Logic; MOS devices; Nitrogen; Oxidation; Silicon; Surface resistance;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2002.808157
  • Filename
    1196018