Experimental estimation of adhesive fracture energy of compliant adhesive tape

The efficient peeling-off of the die from the adhesive wafer tape plays a key role in chip pick-up process, especially, with increasing application of thin/ultrathin chip, which even determines the qualified products ratio. Whether the chip can be peeled off successfully or not, theoretically, dependents on the peeling fracture criterion, that is, the peeling energy release rate obtained by a die has to exceed the critical adhesive fracture energy of the adhesive tape. Here, we present the experimental details to investigate the peeling behavior of the adhesive tape from its adherend, including the estimation of critical adhesive fracture energy etc., using a novel peeling apparatus with an angle-controlled platform. The test results have shown that the detachment between the adhesive tape and the adherend relies mostly on peel angle and peel rate. Recalling the practical process, the peel angle affects directly the ejecting needle force and the higher the peel rate is, the more the work required for a die to get rid of the adhesive tape is.