Title :
Ion-Implanted Impurity Profiles in Ge Substrates and Amorphous Layer Thickness Formed by Ion Implantation
Author :
Suzuki, Kunihiro ; Ikeda, Keiji ; Yamashita, Yoshimi ; Harada, Masaomi ; Taoka, Noriyuki ; Kiso, Osamu ; Yamamoto, Toyoji ; Sugiyama, Naoharu ; Takagi, Shin-ichi
Author_Institution :
Fujitsu Labs. Ltd., Atsugi
fDate :
4/1/2009 12:00:00 AM
Abstract :
We evaluated profiles of B, P, As, and Si implanted in Ge substrates by secondary ion mass spectrometry, analyzed the profile data using a quasi-crystal Lindhard-Scharff-Schiott (QCLSS) theory, tuned its parameters, and established a corresponding database based on a tail function. We also predicted Ge, Sb, Ga, In, and Xe profiles in Ge substrates by using the QCLSS theory and also established a corresponding database. We further evaluated the thickness of the amorphous layers formed by ion implantation by transmission electron microscopy and reproduced it in a model by tuning a corresponding parameter of the through dose. Using a profile parameter database and this through dose, we can predict ion implantation profiles and related amorphous layer thicknesses in Ge substrates over a wide range of ion implantation conditions.
Keywords :
amorphisation; antimony; arsenic; boron; doping profiles; elemental semiconductors; gallium; germanium; impurity distribution; indium; ion beam effects; ion implantation; phosphorus; secondary ion mass spectra; silicon; substrates; transmission electron microscopy; xenon; Ge substrates; Ge:As; Ge:B; Ge:Ga; Ge:In; Ge:P; Ge:Sb; Ge:Si; Ge:Xe; amorphous layer thickness; ion implantation; ion-implanted impurity profiles; profile parameter database; quasicrystal Lindhard-Scharff-Schiott theory; secondary ion mass spectrometry; tail function; transmission electron microscopy; Amorphous materials; Data analysis; Databases; Impurities; Ion implantation; Laboratories; Mass spectroscopy; Predictive models; Quantum cascade lasers; Tail; Amorphous; As; Ga; Ge; In; P; Sb; Si; Xe; ion implantation;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2009.2014193