The influence of the solder joint void on the CCGA package reliability

Author

Yingzhuo Huang ; Binhao Lian ; Quanbin Yao ; Xiaorui Lv ; Pengrong Lin

Author_Institution

Beijing Microelectron. Technol. Inst., Beijing, China

fYear

2014

fDate

12-15 Aug. 2014

Firstpage

850

Lastpage

853

Abstract

Ceramic column grid array (CCGA) package is an extension of the ceramic ball grid array (CBGA) package. The CCGA uses a column instead of a high melt ball to create a higher standoff and more flexible interconnect, and to achieve a significant increase in reliability. The void of the solder joint has a significant influence on the CCGA package reliability. This paper introduced two reflow processes of CCGA717 package (N₂ and vacuum atmosphere), it specifically discussed the solder joint strength, board-level reliability of the CCGA package. By design of the daisy-chain substrate, the board-level reliability of the CCGA packages were investigated. This study showed that with the low void rate(<;5%), the CCGA solder joint will get a high joint strength and high board-level reliability.

Keywords

ball grid arrays; ceramic packaging; integrated circuit reliability; reflow soldering; CBGA package; CCGA package reliability; CCGA717 package; board-level reliability; ceramic ball grid array package; ceramic column grid array package; daisy-chain substrate; high melt ball; reflow processes; solder joint strength; Arrays; Atmosphere; Ceramics; Joints; Reliability; Soldering; Vibrations;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2014 15th International Conference on

Conference_Location

Chengdu

Type

conf

DOI

10.1109/ICEPT.2014.6922781

Filename

6922781