Diamond sawing process of 12 inch low-K silicon wafer applied in smart card

Chip topside peeling is a major problem affecting the quality in diamond sawing process of 12inch low-K silicon wafer applied in smart card chip. The effects of sawing parameters on wafer topside peeling quality are investigated in this work and it is found that the blade height is the main factor influencing the peeling quality. The optimized process showed that the topside peeling did not permeate throughout chip´s seal ring and the stability of peeling performance had been able to meet the mass production quality of 12 inch low-K diamond sawing process in the field of smart card production.