Numerical simulation and analysis on thermal coupling effect of MCM packaging

Simplified MCM packaging models with different chip numbers and different chip distribution were built up. The paper uses numerical simulation method to study the thermal field and thermal stress distribution of package with different chip number, chip arrangement, heat convention coefficient and different substrate material. Multi-chip´s heat resistance also been calculated, but was affected by thermal coupling much and led to the inaccurate results. By simulation result, heat convection coefficient is the most critical factor that affects packaging temperature; change the distribution mode can improve the packaging stability; among the different substrate materials, SiCp/Al is considered as a good packaging material in its proper mechanical and thermal property. From this paper, general heat and stress distribution and their main influence factor of MCM packaging will be obtained, along with their influence mechanism. This paper will have big significance on MCM packaging´s optimization design and improvement of working stability.