Title :
Thermo-mechanical reliability of 3D package under different thermal cycling
Author :
Tianbao Lan ; Fei Su
Author_Institution :
Beihang Univ., Beijing, China
Abstract :
In this paper, thermo-mechanical reliability of a three-dimensional (3D) package based on through-silicon-via (TSV) under different thermal cycling was investigated with finite element method. A finite element simulation of this 3D package was performed in order to compare the thermal stress and fatigue lives of the solder joints with and without underfill. It was found that the fatigue live of solder joints was extended by using of unerfill. The influence of TSV arrangement on the fatigue life of solder was compared.
Keywords :
fatigue; finite element analysis; integrated circuit packaging; integrated circuit reliability; solders; thermal stresses; three-dimensional integrated circuits; 3D package; TSV arrangement; finite element method; finite element simulation; solder fatigue life; solder joints; thermal cycling; thermal stress; thermomechanical reliability; three-dimensional package; through-silicon-via; underfill; Creep; Fatigue; Finite element analysis; Silicon; Soldering; Stress; Through-silicon vias; fatigue life; solder joint; three-dimensional package finite element;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922844
