Title :
Effect of package thermal warpage for POP assembling technique
Author :
Yabing Zou ; Zhenfeng Zhao
Author_Institution :
Reliability Res. & Anal. Center, China Ceprei Lab., Guangzhou, China
Abstract :
POP stacking technique satisfied the demands of miniaturization, function integration and higher memory space for mobile communication products. However, the warpage of POP package during the soldering procedure will bring the unfavorable effects to quality and reliability of the products. The paper introduces the POP assembling procedure, aims to test and results analysis the effect of package warpage for POP assembling technique, summarizes the measurements for minimizing the package warpage.
Keywords :
assembling; product quality; reliability; soldering; thermal management (packaging); POP assembling technique; POP stacking technique; function integration; memory space; mobile communication products; package on package assembling technique; package thermal warpage effect; product quality; product reliability; soldering procedure; Hip; Materials; Reliability; Soldering; Stacking; Temperature measurement; (Head in Pillow) HIP; package on package (POP); shadow moiré; warpage;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922845
