Title :
Heterogeneous Wafer-Scale Circuit Architectures
Author :
Katehi, Linda ; Chappell, William ; Mohammadi, Saeed ; Margomenos, Alexandros ; Steer, Michael
Author_Institution :
Illinois Univ., Urbana-Champaign, IL
Abstract :
This article has presented circuit architectures that allow for the 3D integration and on-wafer packaging through the concept of an Si interposer. The presented 3D integration schemes have allowed for the design and fabrication of a fully integrated receiver that performs at 10 GHz. High-Q passives and 3D interconnects allow for the design of low-cost, high-density circuits that also exhibit very high performance
Keywords :
integrated circuit design; receivers; wafer-scale integration; 10 GHz; 3D integration; heterogeneous wafer-scale circuit architectures; high-Q passives; integrated receiver; on-wafer packaging; Band pass filters; Bandwidth; Circuits; Costs; Filter bank; Filtering; Lead; Military communication; Radio frequency; Transceivers;
Journal_Title :
Microwave Magazine, IEEE
DOI :
10.1109/MMW.2007.316255
